The N2000 is a compact sputtering system with four 150 mm electrodes mounted in a confocal configuration. The electrodes sputter
material onto a central rotating worktable. Designed to coat substrates up to 200 mm diameter the system combines great flexibility with substantial capability.
The system may be fitted with a linear single wafer/platen vacuum load lock. Or for more demanding throughput with a compact four wafer or 25 wafer cassette load lock.
Rotation substrate deposition
200 mm wafer/platen
Variable source to substrate separation
Substrate RF bias
In-situ substrate plane magnetic field projection.